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In Micro Abrasive Processing, finely graded abrasive particles are propelled into a stream of compressed air. The mixture is transported through a hose and focused through a small nozzle to the area to be processed.

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SWAM BLASTER® is the only Micro Abrasive Processing system on the market to provide truly independent control over the pressure and amount of abrasive introduced into the air stream.

  • Precision: Crystal Mark micro abrasive processing technology can feed abrasive particles from as coarse as 500 microns to as fine as the sub-micron level.
  • Versatility: Micro Abrasive Processing can be used for selective cleaning (for example, conformal coating removal from electronic circuit boards), de-burring, micromachining (for example, silicon wafer etching for MEMS circuits on silicon wafers), surface texturing.
  • Automation: The Crystal Mark team has the vertical manufacturing capabilities to design fully automated systems for use in industrial set up.
  • Application Process Development: Crystal Mark has refined methodology to understand application requirements, and to develop a  custom process that provides required controllability, consistency, and precision.
  • Easy to Use: The technology is easy to learn; it doesn’t require highly skilled professionals to run the process.
  • Environmentally Friendly: The process doesn’t use any chemical solvents or harmful chemicals. The disposal of used abrasive particles is clean.

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  • SWAM® Micro Sand Blaster
  • Work Chamber to create a safe, ergonomic work area
  • Dust Collector to collect the spent abrasive for disposal
  • Compressed Air (Carrier Gas)
  • Air Dryer as required
  • In the case of large custom applications, automated systems based on rotary abrader, conveyor belt based system, or 3-axes nozzle positioning systems. Utilizing the above platforms, automation is custom designed as required for the customer’s specific project.
  • Application-specific accessories – for example, point ionizer to control ESD (electrostatic discharge) for conformal coating removal from circuit boards

 

Crystal Mark has also developed a number of Complete Work Cells (CWC) that combine different modules in one.

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  1. Type of abrasive powder: hardness, size, and shape of particles
    • Hardness: Most of the applications require the abrasive to be softer than the substrate to avoid damage to the target workpiece.
    • Size: A larger abrasive particle delivers more kinetic energy to the substrate than a smaller particle.
    • Shape: Abrasive particles that have sharp and pointed edges cut or strip away surface material upon impact faster than rounded or spherically shaped particles.
  2. Air Pressure
  3. The ratio of abrasive powder to airflow volume – powder flow rate
  4. Nozzle Diameter
  5. The distance of the Nozzle from the workpiece
  6. Duration of the process application – feed rate

 

The higher the air pressure and the smaller the nozzle diameter, the faster the abrasive particle is propelled at the workpiece allowing optimum abrading results. When a less aggressive result is desired, the air pressure can be reduced, the amount of powder in the air stream can be adjusted, and/or the nozzle diameter can be increased to slow down the velocity of the abrasive particle thus causing less material removal upon impact.

 

Crystal Mark provides nozzle options ranging from .006″ to .090″ in diameter. It is also possible to develop a fully customized nozzle when required for a specific application.

 

> LEARN MORE: CONTROL VARIABLES FOR A MICRO SANDBLASTING PROCESS

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ONE: Complete Process Control:

Crystal Mark’s SWAM BLASTER® Micro Sandblasters offer adjustable air pressure regulation independent of the powder flow regulation. With the vibratory feed system, SWAM Blasters can handle a much more comprehensive range of abrasives types and size compared to any other competitors.

 

TWO: Unparalleled Performance, Possibilities:

  • Crystal Mark used a vibration-based feed system for abrasives. This allows for a much wider range of abrasive particle sizes and air/gas pressure. The technology allows for abrasive particles as coarse as 500 microns, or as fine as the sub-micron level.
  • For precision in working with sensitive substrates or applications, Crystal Mark micro abrasive equipment is capable of effectively feeding abrasive or other materials at very low pressures, under 1 psi.
  • For aggressive applications, it is possible to feed abrasives at a much higher pressure range – 140-300 psi.

 

THREE: Technology Customized for Application:

  • Crystal Mark has an extensive range of product configurations with the flexibility to customize the solution as required to achieve the customer’s specific objective.
  • As required, Crystal Mark is able to provide a fully automated system or a manual system for Micro Abrasive Processing. Crystal Mark has very strong vertical manufacturing capabilities to design custom fixtures and customized mechanical systems to deliver fully integrated solutions.
  • The Crystal Mark team has refined methodology to understand each application and develop specific product configurations.
  • Customers have the option to send samples and validate the use case before making the decision on buying the equipment.

 

FOUR: Abrasives: Crystal Mark has developed a range of abrasive powders to achieve the required application. In Micro Abrasive Processing, if you can’t control the abrasive then your process is out of control.

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